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july 2011 doc id 16959 rev 2 1/12 12 EMIF06-1005N12 6-line ipad?, low capacitance emi filter and esd protection in narrow micro qfn package features emi symmetrical (i/o) low-pass filter high efficiency in emi filtering at frequencies from 900 mhz to 1.8 ghz very low pcb space consumption: 2.5 mm x 1.2 mm very thin package: 0.55 mm max high efficiency in esd su ppression on inputs pins (iec 61000-4-2 level 4) high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging lead-free package complies with the following standards iec 61000-4-2 level 4 input and output pins ? + 15 kv (air discharge) ? + 8 kv (contact discharge) mil std 883g - method 3015-7 class 3b (all pins) applications where emi filtering in es d sensitive equipment is required: lcd and camera for mobile phones computers and printers communication systems mcu boards keypad for portable equipment tm : ipad is a trademark of stmicroelectronics. figure 1. pin configuration (top view) figure 2. basic cell configuration description EMIF06-1005N12 is a 6-line, highly integrated device designed to suppress emi/rfi noise in all systems exposed to electromagnetic interference.this filter includes esd protection circuitry, which prevents damage to the application when subjected to esd surges up to 15 kv on the input pins. 1 12 qfn-12l 1 input output 12 output 11 output 10 output 9 2 input 3 input 4 input output 8 output 7 5 input 6 input typical line capacitance = 45 pf @ 0 v 100 input output www.st.com
characteristics EMIF06-1005N12 2/12 doc id 16959 rev 2 1 characteristics figure 3. electrical characteristics (definitions) table 1. absolute ratings (limiting values) symbol parameter and test conditions value unit v pp esd discharge iec 61000-4-2, level 4 air discharge contact discharge esd-machine model : (mm: c = 200 pf, r = 25 l = 500 nh) esd-charged device model: (jesd22-c101d) 15 15 2 1 kv t j junction temperature at t amb = 25 c 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 8 10 v v f i f = 10 ma 0.5 1 1.5 v i rm v rm = 3 v per line 200 na r i/o tolerance 15% 85 100 115 c line v line = 0 v, v osc = 30 mv, f = 1 mhz 38 45 52 pf i v i f i rm i r i pp v rm v f v br v cl symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = forward current i = peak pulse current i = breakdown current v = forward voltage drop r br rm rm rm pp r f v = clamping voltage cl f d = dynamic impedance i = forward current r = series resistanc between input and output c = input capacitance per line pp i/o line
EMIF06-1005N12 characteristics doc id 16959 rev 2 3/12 figure 8. esd test conditions for figure 6 and figure 7 figure 4. s21 attenuation measurement figure 5. analog cross talk measurements 300k 1m 3m 10m 30m 100m 300m 1g 3g - 60 - 50 - 40 - 30 - 20 - 10 0.0 s21 (db) i2-o2 i3-o3 i4-o4 i5-o5 i1-o1 i6-o6 i2-o2 i3-o3 i4-o4 i5-o5 i1-o1 i6-o6 f = 110 mhz c -31 -35 s21(db) f = 900 mhz s21(db) f = 1.8 ghz f(hz) v = 0v bias 300k 1m 3m 10m 30m 100m 300m 1g 3g - 130 - 120 - 110 - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0.0 i2-o5 i2-o3 xtalk (db) v = 0v bias f(hz) figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge). remaining voltage on filter output figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge). remaining voltage on filter output v max cl 27.2 v 3.3 v 4.6 v v cl @ t = 30 ns v cl @ t = 100 ns output c1 5 v/div 20 ns/div v max cl -20.7 v -787 mv -3.2 v v cl @ t = 30 ns v cl @ t = 100 ns c1 output 5 v/div 20 ns/div d.u.t attenuator 20?60db 50 ohm >500mhz oscilloscope with 50 ohm input mode
characteristics EMIF06-1005N12 4/12 doc id 16959 rev 2 figure 11. line capacitance versus applied voltage figure 9. esd response to iec 61000-4-2 (+15 kv air discharge) on one line figure 10. esd response to iec 61000-4-2 (-15 kv air discharge) on one line input 5 v/div 2 v/div 100 ns/div 100 ns/div output c2 c3 c2 input c3 output 5 v/div 100 ns/div 2 v/div 100 ns/div 0 5 10 15 20 25 30 35 40 45 50 0123456 c(pf) v (v) r
EMIF06-1005N12 ordering information scheme doc id 16959 rev 2 5/12 2 ordering information scheme figure 12. ordering information scheme emif yy - xxx z nx emi filter number of lines information x = resistance value (ohms) z = capacitance value / 10(pf) package nx = narrow micro qfn x leads
package information EMIF06-1005N12 6/12 doc id 16959 rev 2 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. qfn-12l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.5 0.55 0.018 0.020 0.022 a1 0.02 0.05 0.0008 0.002 b 0.15 0.2 0.25 0.006 0.008 0.010 d 2.45 2.5 2.55 0.096 0.098 0.10 d2 1.75 1.8 1.85 0.069 0.071 0.73 e 1.15 1.2 1.25 0.045 0.047 0.050 e2 0.25 0.3 0.35 0.010 0.012 0.014 e 0.4 0.016 l 0.15 0.25 0.35 0.006 0.010 0.014 figure 13. footprint recommendations figure 14. marking top view side view bottom view d e e b a1 a l pin#1 id d2 e2 1.8 0.4 0.3 0.45 2.2 1.6 0.2 kb
EMIF06-1005N12 package information doc id 16959 rev 2 7/12 figure 15. flip-chip tape and reel specification note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. user direction of unreeling all dimensions in mm 4.0 0.1 8.0 0.20 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 1.20 0.10 1.40 0.10 2.70 0.10 4.0 0.1 dot identifying pin a1 location 2.0 0.05 0.25 0.02 kb kb kb
recommendation on pcb assembly EMIF06-1005N12 8/12 doc id 16959 rev 2 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 16. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 17. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = stencil window footprint 200 m 450 m 420 m 190 m 15 m 15 0.2 2.2 0.4 m 5m 300 m 1800 m 170 m 1600 m 100 m 100 m 65 m 65 m 5m 1.8 0.45 1.6 0.3
EMIF06-1005N12 recommendation on pcb assembly doc id 16959 rev 2 9/12 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendation on pcb assembly EMIF06-1005N12 10/12 doc id 16959 rev 2 4.5 reflow profile figure 18. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
EMIF06-1005N12 ordering information doc id 16959 rev 2 11/12 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF06-1005N12 kb qfn-12l 4.48 mg 3000 tape and reel 7? table 5. document revision history date revision changes 12-jan-2010 1 initial release. 03-jul-2011 2 updated package name throughout the document.
EMIF06-1005N12 12/12 doc id 16959 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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